878Pro Heat Gun1. Suitable for disassembly of vari

1. Suitable for disassembly of various components, such as: SOIC,CHIP,QFP,PLCC,BGA, etc. 2. Used for heat shrinkage, drying, paint removal, glue removal, thawing, preheating, glue welding, etc. Barcode (EAN) 6922297031366