R-868 BGA

This lead-free solder paste is made by environmental protection formula with high-technolo-gy.Using imported ether and alcohol compoun-ds as solvent makes this soldering paste high boiling point, less volatile, less smokey, and low odor during soldering. Using special rosin synthetic resin as solute and non-ionic macromolecule organic activator, wh-ich is no corrosion to the items. This soldering paste is with the features that high temperature resistance (200-400℃),well wettability for surface tension reducing, high-efficiency of removing oxide, firm and bright welding spot, non-conducting and no-clean after using. This product is special for soldering IC of mobile phone and digital products, also can be used as an adhesive of tin paste.